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Semicon. WaferTest, Assembly & Test/ Burn-in Equip

In conjunction with:
  • Date and Time:
    Ongoing Tender Sale


  • Preview:
    By appointment only.
  • Location
    Avenida 1° de Maio 801
    Vila do Conde, , Portugal
    Contact
    Daniel Kroeger
    Main: 49 8151 973420

    danielk@maynards.com
    Details

    !!! -- SURPLUS TO THE ONGOING OPERATIONS OF NANIUM S.A., Portugal -- !!!

    By order of NANIUM S.A., Portugal

    Ongoing Tender Sale of Semiconductor Wafer Test, Assembly & Test/ Burn-In Equipment
    FINAL SALE PHASE in the NANIUM Backend Tool Sale in Portugal.

    • Assembly
      • Alphasem
      • ESEC
    • Burn in
      • (3) AEHR MTX Burn In Oven 30000H
      • (4) JEC Burn In Oven P6502
      • (1) BLU MIRAE M820 Loader/Unloader
      • (5) BLU MIRAE M9220 Loader/Unloader
      • Ando
    • Mark-Pack
      • Ismeca
      • STI
      • Rood Technology
    • Packaging
      • FICO
      • Heraeus
      • Meco
    • Sort-Test
      • (2) Advantest T5585
      • (2) Advantest M6761 AD
      • (12) Advantest M6771 AD
      • (2) Advantest T5365 TAG5 tester
      • (2) Advantest T5501
      • (1) Advantest T5581H
      • (4) Power supply Salland IDPS 465
      • (1) Credence, Sapphire Tester
      • ESI
      • Microhandling
    • (2) HTTP Cooling units

    View detailed equipment catalogue HERE

    If you wish to receive the complete list of almost 300 Tools, please contact Daniel Kroeger on danielk@maynards.com

    ABOUT NANIUM:
    NANIUM, formerly known as Qimonda / Infineon, is a provider of advanced assembly and test services to Semiconductor companies in communication, automotive, medical and computer industries and is based nearby Porto in Portugal. NANIUM provides solutions ranging from package design to prototyping, wafer-level packaging (WLP), wafer probe, assembly and test.
    With state-of-the-art equipment, including 300mm wafer-level packaging capabilities, NANIUM offers the industry’s most advanced fan-out/fan-in WLP, system-in-package (SiP) solutions and advanced 3D packaging.

    Additional Information:
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